The Die Products Consortium (DPC)

The Die Products Consortium is a group of leading microelectronics companies collaborating to enlarge the worldwide markets for die products (including bare or bumped die and wafer-level csp).

The DPC program is dedicated to providing timely, informative and thought-provoking information about insertion of die products into electronic systems. Member companies participate in a variety of projects focusing on die products test, assembly, standardization, infrastructure, and market intelligence.

http://www.dieproducts.org

KGD Packaging and Test Workshop

Dynalog Systems, Inc. manages International KGD Packaging and Test Workshop, hosted annually by the Die Products Consortium.

The workshop brings together die products practitioners from around the world to exchange the latest information on die products and microelectronics test and assembly technologies at the leading edge of the industry.

http://www.napakgd.com